AI Infrastructure
AI infrastructure and compute ecosystem
Articles
Ferroelectric Tuning Reduces Optical-Interconnect Stalls in LLM⭐9
Georgia Tech researchers use ferroelectric tuning in optical interconnects to reduce data-transfer bottlenecks, cutting latency and energy use in large language...
Open-Source Benchmark Suite for 2.5D/3D Heterogeneous⭐7
UCLA releases open-source benchmark suite for 2.5D/3D heterogeneous integration physical design, enabling standardized testing of placement, routing, and therma...
Deep Learning Automates Parameter Extraction for 2D Transistors:⭐9
Deep learning automates 2D transistor parameter extraction, boosting speed and consistency for nanoscale semiconductor characterization and modeling.
Planning Your AI Design Journey: Start With What You’d Lose⭐9
Discover how to plan your AI design journey by focusing on what you stand to lose, prioritizing risks for smarter adoption strategies.
Agentic AI Success Relies On Excellent Human Scaffolding⭐9
Agentic AI success depends on human scaffolding—oversight, clear workflows, and governance—to optimize performance and ensure safe, reliable autonomous operatio...
From Specification to Formal Properties: A 2026 Guide⭐10
From specification to formal properties: a 2026 guide on refining requirements into verifiable assertions, covering decomposition, safety/liveness, and best pra...
Chip Security Moves From Checkbox Compliance To Continuous Defense⭐9
Chip security shifts from static checkbox compliance to continuous defense in 2026, tackling evolving hardware threats with runtime monitoring and proactive mea...
Semiconductor Engineering Blog Review: August 2026⭐9
August 2026 semiconductor engineering review: advanced packaging, chiplet design, AI-driven EDA, and low-power edge AI trends shaping the industry.
Redefining Roles for Edge and Cloud AI in 2026⭐10
Explore the evolving roles of edge and cloud AI in 2026, from reduced latency and privacy to scalable cloud power—discover their collaborative future.
Multi-Die Assemblies Dominate at 2nm and Below⭐9
Multi-die assemblies and chiplets are replacing monolithic designs at 2nm and below, driven by yield, cost, and performance gains via advanced packaging.