AI Infrastructure
AI infrastructure and compute ecosystem
Articles
Building AI Infrastructure for Greater Choice and Flexibilityโญ8
Discover how flexible, modular AI infrastructure built on open standards, chiplets, and heterogenous computing delivers greater choice and scalability in 2026.
Generative AI on a General-Purpose Neural Processor (GPNPU):โญ10
Generative AI is reshaping accelerator design. Explore how General-Purpose Neural Processors (GPNPUs) handle LLMs, diffusion, and multimodal workloads in 2026.
How to Define CPU and Software Stack Performance for Agentic AIโญ9
Agentic AI shifts performance to CPU orchestration, concurrency, and software stack efficiency. Learn the key metrics that define end-to-end agentic workload pe...
Agentic AI Automates RTL Waveform Analysis and Debuggingโญ9
Columbia and Google researchers use agentic AI to automate RTL waveform analysis and debugging, cutting chip verification time from hours to minutes while scali...
Chip Industry Technical Paper Roundup: October 13, 2026โญ8
Explore this week's chip industry technical paper roundup covering AI-assisted EDA, low-power design, advanced packaging, chiplet integration, test analytics, a...
Carbon-Dot Interface Enables Ultrathin High-ฮบ Dielectrics on 2Dโญ9
Carbon dots enable uniform ultrathin high-ฮบ dielectric growth on 2D semiconductors, overcoming a key barrier to scaling next-generation transistors beyond silic...
Deterministic Nucleation Paves the Way for Controlled Growth ofโญ9
Korean researchers achieve deterministic nucleation of 2D semiconductors, enabling precise control over crystal growth for next-generation electronics.
On-Chip Monitors Detect Bit-Flip Attacks in AI Acceleratorsโญ9
Researchers develop lightweight on-chip monitors that detect bit-flip attacks in AI accelerators with under 5% area and power overhead, enabling real-time anoma...
Startup Funding Rebounds in Q3 2026: AI Chips and Advancedโญ9
Q3 2026 semiconductor startup funding rebounded to $4.8B, up 32% YoY, led by AI accelerators, EDA, and advanced packaging.
Finding Critical Defects Before They Become Costly Failures:โญ10
Hybrid bonding and advanced packaging process control: detect critical defects like voids, misalignment, and contamination before they cause costly multi-die fa...