AI Infrastructure
AI infrastructure and compute ecosystem
Articles
Mathematical Model Explains Bondwave Velocity and Acceleration⭐9
Mathematical model explains bondwave velocity and acceleration in direct wafer-wafer bonding, enabling enhanced process control and yield in advanced semiconduc...
Chip Industry Week In Review - Aug 7, 2026⭐8
Semiconductor sector review covering 2026 chip design trends, manufacturing nodes, packaging advances, and market developments.
Scaling Security with Shared IDEs for PCIe Bifurcation: Reducing⭐8
Discover how Shared IDEs simplify PCIe bifurcation security, reducing complexity and resource demands for scalable, efficient hardware management.
Processing-in-Memory Simulator Expands to Support 11 Memory⭐9
New PIM simulator expands to support 11 memory technologies, enabling flexible, energy-aware modeling for DRAM, SRAM, and emerging NVMs in HPC and edge designs.
GPU-Accelerated Differentiable Framework Resolves Speed-Accuracy⭐8
A GPU-accelerated differentiable framework from Duke and Synopsys speeds up switching power analysis without sacrificing accuracy, resolving the speed-accuracy ...
Building AI Factories: The Role of Semiconductor IP Solutions⭐9
Building AI factories demands scalable semiconductor IP for custom accelerators, domain-specific blocks, and ultra-low-power edge solutions.<br>
Implementing the Cyber Resilience Act: A Practical Guide for 2026⭐10
A practical guide to EU Cyber Resilience Act compliance in 2026: key obligations, milestones, and actionable steps for semiconductor and electronics manufacture...
Hybrid Computing Framework Looks Beyond Peak TOPS/W for AI Efficiency⭐8
Hybrid computing framework boosts AI energy efficiency beyond TOPS/W, cutting power use by 30% with adaptive task allocation.
Why Simulation Speed Is Holding Chiplets Back⭐10
Chiplet design faces a major bottleneck: simulation speed. Explore how multi-die complexity, mixed-fidelity modeling, and cross-domain effects hinder
Chip Industry Technical Paper Roundup: August 2026⭐9
Chip industry research roundup for August 2026: advanced nodes, AI-driven EDA, packaging innovations, and emerging computing paradigms shaping semiconductor des...