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Open Benchmark Evaluates AI Thermal Models for 2.5D and 3D ICs

Open Benchmark Evaluates AI Thermal Models for 2.5D and 3D ICsNEW⭐9

📅 2小时前👁 4 views

A new open benchmark from UTS, TU Munich, and ShanghaiTech evaluates AI and machine-learning thermal models for 2.5D and 3D IC design.