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A Composable Thermal Solver for Heterogeneous 2.5D/3D-IC

A Composable Thermal Solver for Heterogeneous 2.5D/3D-ICNEW⭐9

📅 2小时前👁 5 views

Cadence and Notre Dame present a composable thermal solver for heterogeneous 2.5D/3D-IC packages, modeling chiplets, interposers, and hybrid bonding as modular,...